Against the backdrop of rapid global technological development, Silicon Photonics Heterogeneous Integration, as a cutting-edge technology, is gradually becoming a key force driving the development of information communication, data processing, and intelligent systems. Silicon based optoelectronic technology combines the advantages of silicon materials and photon technology, not only breaking through the speed and bandwidth limitations of traditional silicon electronic devices, but also demonstrating significant advantages in energy consumption, integration, and cost. Especially in the fields of data centers, optical communication, sensors, and quantum computing, the application prospects of silicon-based optoelectronic technology are broad and full of potential. However, the practical application and technological implementation of silicon-based optoelectronic heterojunction integration face many challenges, including material compatibility, complexity of integration processes, cost control, and optimization of system performance.
In order to promote the development of silicon-based optoelectronic heterogeneous integration technology, assist in industry technological innovation, and accelerate the development and industrialization of key industrial components. The 3rd Global Digital Trade Expo 2024, sponsored by the People's Government of Zhejiang Province, the Ministry of Commerce of the People's Republic of China, and co organized by the Hangzhou Municipal People's Government, the Department of Commerce of Zhejiang Province, and the Foreign Trade Development Affairs Bureau of the Ministry of Commerce, will be held in Hangzhou Grand Convention and Exhibition Center from September 25 to 29, 2024. We will invite nearly a hundred countries and international organizations, attract thousands of digital trade enterprises, organize tens of thousands of professional buyers, and jointly promote global digital trade cooperation and development. The 2024 Optoelectronic Encapsulation CPO and Heterogeneous Integration Forward Technology Exhibition and Exchange Conference, co organized by Hangzhou Convention and Exhibition Group and Yimao Automobile, was held on September 27th in Hangzhou. It was jointly organized by semiconductor material suppliers, optical chip manufacturers, optical device manufacturers, optical module manufacturers, OSAT, system integrators, heat dissipation solution providers, testing&verification manufacturers, research institutes, data center operators and other upstream and downstream industry enterprises. The conference will invite experts from research institutions, enterprises and government departments around the world to deeply explore the latest progress, application examples and future development directions of silicon-based optoelectronic heterogeneous integration technology and CPO.
"Focus on CPO& Silicon Photonics & Heterogeneous Integration Technology"
"Exploring Advanced optoelectronic Packaging"
01 International Perspective and Participation
Invite semiconductor industry giants, innovative enterprises, and renowned academic institutions from around the world to participate in the exhibition, ensuring the international influence and technological level of the exhibition. Invite leaders, experts, scholars, and government officials from the global semiconductor industry to participate in in-depth discussions on industry trends, technological innovations, policy environments, and other issues.
02 International perspective and participation
Invite semiconductor industry giants, innovative enterprises, and renowned academic institutions from around the world to participate in the exhibition, ensuring the international influence and technological level of the exhibition. Invite leaders, experts, scholars, and government officials from the global semiconductor industry to participate in in-depth discussions on industry trends, technological innovations, policy environments, and other issues.
03 Government led, authoritative policy interpretation
The conference was hosted by the People's Government of Zhejiang Province the Ministry of Commerce of the People's Republic of China, and co organized by the Hangzhou Municipal People's Government the Department of Commerce of Zhejiang Province the Foreign Trade Development Affairs Bureau of the Ministry of Commerce. The 2024 Third Global Digital Trade Expo held at the same time is the only national and international professional exhibition with the theme of digital trade approved by the Chinese government. Holding the Digital Trade Fair is an important measure to implement the decision and deployment of the 20th National Congress of the Communist Party of China on "developing digital trade and accelerating the construction of a strong trading nation". This conference is attended by authoritative government representatives to interpret semiconductor industry policies, allowing participating enterprises to familiarize themselves with and understand the policies, fully enjoy the policy dividends, and promote the stable and healthy development of enterprises.
04 Exhibition of Technological Innovation Achievements and Foresight
Establish a "Optoelectronic Encapsulation CPO and Heterogeneous Integration Exhibition Area" to showcase silicon-based optoelectronic heterogeneous integration products based on new materials and cutting-edge technologies (semiconductor materials, optical materials, electronic materials, CPO devices, optical engine suppliers, laser suppliers, switch manufacturers, silicon optical foundries, heat dissipation). The online and offline participation forms enable participants to have a better understanding of the application and future trends of silicon-based optoelectronic heterojunction integration technology.
05 Business docking and cooperation platform
Establish a professional business liaison area to provide one-on-one business negotiation opportunities for enterprises and promote substantive cooperation. Establish an online customer appointment platform to make real-time appointments with corresponding customers, achieving a combination of online and offline business docking.
Semiconductor material suppliers, optical chip manufacturers, optical device manufacturers, optical module manufacturers, OSAT, system integrators, heat dissipation solution providers, testing&validation manufacturers, research institutes, data center operators
Display scope:
1. Materials: base material, substrate material, compound, adhesive material, sealing material, heat dissipation material, etc
2. Optical chips: laser chips, detector chips, silicon optical chips, amplifier chips, etc
3. Optical devices: active devices (lasers, detectors, modulators, etc.), passive devices (planar waveguides, gratings, couplers, etc.), silicon optical devices
4. Optical modules: optical modules for data centers&silicon optical modules
5. Equipment: Solid crystal bonding machine, bonding machine, plastic sealing machine, cleaning equipment, etc
6. Testing&Validation: Testing equipment, analyzers, etc
7. Silicon optical integration process platform
8. Data center operators
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